Mechanical architecture for accelerated compute
AI Server Chassis Built for Heat, Weight and Rapid Hardware Change
Custom sheet metal platforms for GPU compute, inference, HPC and data-center appliances where airflow and structural loading define success.
Review Your GPU Layout
Custom compute formats
Forming capability
Welding stations
Scalable production
High-density mechanical priorities
The enclosure must support the compute architecture
GPU systems combine high thermal load, concentrated mass, dense cabling and short product cycles. The chassis needs to respond as an engineered structure.
High-flow thermal path
Fan-wall geometry, inlet area, baffles and cable volumes arranged to feed accelerator zones with less recirculation.
Heavy component support
Formed rails, brackets and load paths protect GPUs, power modules and boards during handling and shipment.
Cable routing volume
Power and signal paths planned to reduce airflow blockage and keep assembly repeatable.
Platform adaptability
Modular panels and brackets make board or accelerator changes easier to absorb.
Thermal design inputs
Give the chassis team more than a wattage number
Useful mechanical decisions depend on component map, pressure requirements, fan strategy and acceptable service conditions.
Quantity, slot width, length and retention method.
Size, pressure target, redundancy and replacement path.
Drives, cabling, heatsinks and backplane obstruction.
U-height, depth, rail interface and loaded mass.
DFM engineers
From design package to metal platform
Manufacturing support for fast-moving hardware teams
At Hengtai Leading Technology, our engineers review bends, structural features, hardware access and tolerance strategy before fabrication. We build prototypes without hard tooling, then transition them to repeatable production as demand grows.
- 12KW fiber laser cutting
- CNC forming up to 200T and 4 meters
- TIG, MIG and laser welding capability
- Hardware insertion, coating and assembly
Scale with controlled evidence
Prototype fit
Confirm boards, GPUs, fans and power modules physically.
First article
Inspect critical dimensions and agreed appearance.
Production control
Fixtures and work instructions preserve repeatability.
GPU server chassis engineering
Designing Chassis Around GPU Thermal Density
An AI server chassis must be designed around accelerator power, card geometry and the cooling architecture. H100, MI300 and RTX AI servers create different mechanical constraints even when they share a rack height.
Reserve manifold, hose bend, leak-detection and quick-disconnect access before the internal frame is frozen.
| GPU platform | Thermal emphasis | Fan-wall strategy | Cooling readiness |
|---|---|---|---|
| NVIDIA H100 | Very high accelerator density | High-static-pressure, low-leakage path | Air or direct-liquid architecture |
| AMD MI300 | Dense compute and memory heat | Uniform flow across accelerator zones | Manifold and service clearance planning |
| RTX AI Servers | Multiple long add-in cards | Card-to-card airflow separation | Air-first with future liquid allowance |
Build the mechanical foundation
Send your GPU layout and chassis constraints
Include rack height, component list, cooling concept, loaded mass and quantity targets.
info@sheetmetalmfg.comBuilding 3, No. 58 Xiangyuan Road, Changshu High-tech Industrial Development Zone, Suzhou City, Jiangsu Province, China